Automotive High-Speed Hardware Design Engineer

Job Description Key Responsibilities: . Lead hardware design and development for ADAS, Cockpit, and Connectivity ECUs, from concept to production . Design high-speed digital boards with advanced SoCs, DDR4/DDR5, LPDDR interfaces, PCIe, Ethernet (RGMII/SGMII/RMII/10G), USB, MIPI CSI/DSI, and SerDes. . Perform schematic design, component selection, and BOM optimization ensuring automotive-grade reliability and cost efficiency. . Conduct Signal Integrity (SI) and Power Integrity (PI) analysis for critical high-speed signals and power rails. . Support thermal design and validation, collaborating with mechanical and thermal engineers to ensure performance under harsh automotive conditions. . Ensure ASIL-D compliance (ISO 26262) for safety-critical designs participate in FMEA, FMEDA, and safety architecture reviews. . Interface with camera, radar, LiDAR, and sensor fusion modules, ensuring signal quality, timing, and synchronization. . Collaborate with PCB layout engineers for constraint-driven designs (impedance, stackup, crosstalk, EMI/EMC). . Drive hardware validation and bring-up, including board-level testing, debugging, and root-cause analysis. . Work with cross-functional teams (System, Software, Validation, Manufacturing, EMC) through design verification and PPAP stages. . Support DFMEA, DFx (DFM, DFT, DFA) activities to ensure manufacturability and reliability. . Create design documentation, validation reports, and participate in technical reviews and customer discussions. . Required Skills and Experience: . Bachelor's or Master's Degree in Electronics, Electrical, or related engineering field. . 5-9 years of hands-on experience in automotive hardware design. . Proven experience with SoC-based board design (e.g., NVIDIA, Qualcomm, Renesas, TI, NXP, Infineon AURIX). . Strong understanding of ADAS, Cockpit, and IVI architecture including sensor and compute domains. . Expertise in high-speed design (DDR4/5, PCIe, MIPI, Ethernet, USB 3.x, LVDS, SerDes). . Experience with SI/PI analysis tools (e.g., HyperLynx, Sigrity, Ansys, Cadence). . Knowledge of Automotive Safety (ISO 26262 - ASIL B to D compliance). . Familiarity with EMI/EMC standards (CISPR 25, ISO 11452) and compliance testing. . Understanding of thermal design, power sequencing, and power distribution. . Experience in camera/radar interface and sensor fusion hardware design. . Proficiency in schematic tools (Altium, Cadence Allegro, Mentor DxDesigner, Zuken CR8000). . Hands-on experience with hardware bring-up, debugging, and lab instruments (oscilloscope, logic analyzer, power analyzer, etc.). . Excellent analytical, communication, and documentation skills. . Preferred Qualifications: . Experience with ASIL-D compliant ECU development. . Exposure to Ethernet TSN, CAN-FD, LIN, FlexRay and in-vehicle communication networks. . Knowledge of thermal simulation and mechanical integration. . Familiarity with AI/ML accelerator SoCs used in perception and fusion ECUs. . Experience working with global OEMs and Tier-1s on production projects. . Key Tools & Technologies: . Schematic/PCB: Zuken , Altium Designer, Cadence Allegro, Mentor Graphics . Simulation: HyperLynx, Ansys SIwave, Sigrity, SPICE, ADS . Compliance & Debug: Oscilloscope (≥20GHz), Vector CANoe, Power Analyzer, JTAG . Documentation: PDM/PLM systems, Jira, Confluenc Qualifications B.E, Electronics Engineering Additional Information 5 to 10 years