Staff NPI Package Design Engineer

For over four decades, Cirrus Logic has been propelled by the top engineers in mixed-signal processing. Our rockstar team thrives on solving complex challenges with innovative end-user solutions for the world's top consumer brands. Cirrus Logic is also known for its award-winning culture, which was built on a foundation of inclusion and fairness, meaningful community engagement, and delivering enjoyable employee experiences at every turn. But we couldn’t do it without our extraordinary workforce – and that’s where you come in. Join our team and help us continue to make Cirrus Logic an exceptional place to grow your career!

Are you ready to make a significant impact in a fast-paced, innovative environment? We are seeking a Staff Package Design Engineer to join our dynamic team. In this role, you’ll work closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs.

Responsibilities

• Collaborate with cross-functional teams to drive package designs that meets Cirrus performance, reliability, and manufacturability requirements

• Define package requirements from electrical, thermal, and mechanical point of view in close cooperation with Design and layout teams

• Utilize AutoCAD, GDS tools, Siemen Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information

• Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB

• Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages

• Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues

• Grow and promote automation processes throughout the package design flow

• Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance

• Close collaboration with customers to resolve various design issues between the piece part and PCB

• Required Skills and Qualifications

• BS or above in Mechanical, Electrical, Chemical, or Materials Engineering

• 5 to 8+ years of experience in a packaging-related field

• Experienced Cadence SiP layout user

• Strong AutoCAD user

• Knowledge of packaging technologies, materials, package substrate design and assembly rules

• Understanding of electrical simulation results on a package design

• Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations

• Strong written and verbal communication skills; able to review technical ideas with customers and high-level management

• Self-starter with a strong sense of ownership and accountability for driving projects to completion

• Ability to build strong, influential relationships in a collaborative environment within a diverse setting

• Preferred Skills and Qualifications

• Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)

• Broad reading in the area of interest and the desire to continue that reading with access to the high quality company library resource, material properties knowledge

• Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training opportunities available through company resources

• Electrical simulation skills

• Experience using Siemens Fast 3D

• Experience using Siemens Calibre DRV