Process Engineer

Role Overview: As a Process Engineer at our global team in Beijing, your primary responsibility will be to serve as the process owner of the Die Bonding (DB) process. You will be providing technical support across the entire product lifecycle, from early R&D phases to mass production, collaborating with various departments to develop new processes, optimize existing ones, and drive continuous improvement in productivity, quality, and cost reduction. Key Responsibilities: - Develop new processes and design reviews for projects - Improve cycle time, capacity, and cost efficiency - Enhance process capability and yield - Conduct failure analysis and troubleshoot process issues - Fulfill additional tasks and responsibilities as required to meet department objectives Qualifications Required: - Bachelor's degree or above in Microelectronics/electronics, mechanical engineering, or semiconductor packaging - Minimum of 5 years of experience in die bonding, flip chip processes, and equipment - Hands-on experience with DB equipment such as Besi, ASM, etc - Proficiency in reading and understanding drawings and specifications - Experience with statistical process control (SPC), Failure Mode and Effects Analysis (FMEA), Design of Experiments (DOE), Tolerance design, and other quality tools - Familiarity with software like Creo for designing process fixtures - Ability to troubleshoot independently and find solutions - Strong data collection, analysis, and problem-solving skills - Team-oriented with effective multitasking capabilities - Proactive, accountable, and able to work under pressure to meet deadlines Please note that this position is based in Beijing, China, with collaboration with global teams, reporting to the Senior Manager, Process Engineering. By joining us, you will have the opportunity to contribute to a critical area of growth, work on innovative solutions, and enjoy a competitive salary, benefits package, and a dynamic international working environment. Feel free to reach out for more information. Role Overview: As a Process Engineer at our global team in Beijing, your primary responsibility will be to serve as the process owner of the Die Bonding (DB) process. You will be providing technical support across the entire product lifecycle, from early R&D phases to mass production, collaborating with various departments to develop new processes, optimize existing ones, and drive continuous improvement in productivity, quality, and cost reduction. Key Responsibilities: - Develop new processes and design reviews for projects - Improve cycle time, capacity, and cost efficiency - Enhance process capability and yield - Conduct failure analysis and troubleshoot process issues - Fulfill additional tasks and responsibilities as required to meet department objectives Qualifications Required: - Bachelor's degree or above in Microelectronics/electronics, mechanical engineering, or semiconductor packaging - Minimum of 5 years of experience in die bonding, flip chip processes, and equipment - Hands-on experience with DB equipment such as Besi, ASM, etc - Proficiency in reading and understanding drawings and specifications - Experience with statistical process control (SPC), Failure Mode and Effects Analysis (FMEA), Design of Experiments (DOE), Tolerance design, and other quality tools - Familiarity with software like Creo for designing process fixtures - Ability to troubleshoot independently and find solutions - Strong data collection, analysis, and problem-solving skills - Team-oriented with effective multitasking capabilities - Proactive, accountable, and able to work under pressure to meet deadlines Please note that this position is based in Beijing, China, with collaboration with global teams, reporting to the Senior Manager, Process Engineering. By joining us, you will have the opportunity to contribute to a critical area of growth, work on innovative solutions, and enjoy a competitive salary, benefits package, and a dynamic international working environment. Feel free to reach out for more information.