Board Thermal Simulation Engineer

Perform component-level thermal analysis including junction temperature calculation, hot-spot identification, and heat-path evaluation.

Develop thermal models using analytical methods and simulation tools for steady-state and transient conditions.

Evaluate and recommend cooling strategies (conduction, convection, radiation, heat spreading) for avionics boards.

Assess temperature effects on component aging, reliability, and derating requirements.

Analyze thermomechanical degradation risks including CTE mismatch, solder fatigue, and connector stress.

Perform system-level thermal budgeting and define thermal interface requirements across subsystems.

Evaluate environmental thermal loads from orbit-induced temperature swings and operational heat dissipation.

Select materials based on thermal conductivity, expansion properties, and long-term reliability.

Validate thermal models with empirical measurements and test data from EM and QM builds.

Collaborate with electrical, mechanical, and reliability engineers for integrated thermal solutions.

Document thermal requirements, design guidelines, and analysis results.