R&D Application Engineer III

RD Application Engineer III Business Unit: MAES Division: Packaging Board Assembly Who are we looking for We are seeking a technically strong and customer focused Application Engineer who can bridge the gap between product technology and real world customer applications. With hands on technical expertise, the ability to understand complex application processes, and a passion for helping customers achieve the best performance from our products. With the ability to thrive in environments where innovation, problem solving, and technical collaboration are at the forefront. What will you be doing This position is highly laboratory focused, spanning test method development, DOE driven process optimization, reliability testing, and failure analysis. Your responsibilities will include: Technical Support Problem Solving: The application engineer will support development, validation, and optimization of next generation electronic materials, including advanced die attach solutions and sintered nanomaterials. Troubleshoot issues faced by customer during or post new product introduction (NPI) stage Conduct failure mode analysis, identify defects, material related issues, and recommend improvements. Application Testing Process Development: Perform product evaluations, trials, and performance testing Support sample build campaigns by designing builds, commissioning for production using specialized tools. Optimize application processes conditions, or product usage guidelines Prepare technical reports, test summaries, and recommendations Customer Engagement: Conduct field trials or on site customer testing Translate customer needs into technical requirements for internal teams Cross Functional Collaboration: Work closely with RD, customer technical support, sales, and product management to support new product introductions and technical projects Instrument Skills: Operate and manage laboratory application process equipment including screen printers, pick-and-place machines, reflow ovens, sinter presses, environmental test chambers, die shear machines, and electrical probing systems. Perform periodic maintenance on assigned equipment to ensure optimal working conditions. Who are You B.E. / MSc/ M.E. / MTech in Electronics, Materials Science, Nanotechnology, Physics, or related fields. 5+ years of experience in semiconductor assembly or materials-based application process development. Experience with die attach or advanced packaging preferred. What competencies will you need Strong analytical thinking and problem solving. Excellent documentation and communication. Ability to manage multiple projects. Proficiency with DOE, ANOVA, MSA, FMEA. Strong skills in Excel and Minitab. Familiar with CAD tools like SolidWorks. Disclaimer : This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.