Source description
About the role
We have a requirement for thermal simulation and find the JD below Thermal Simulation for the characterization and development of power modules Flip chip BGA wire bond on package, board, and system level Generation of simulation and compact models for end customers. Thermal virtual prototyping and simulation-based product optimization. Thermal consulting of internal customers from development and application; close interaction with customers from a problem statement to simulation results interpretation and delivery. Working in close exchange with the multi-cultural team. A degree in Mechanical / Electronics Engineering, Physics, or a similar field At least 3-5 years of professional experience in thermal FEM/ CFD simulations Very good hands-on experience with Ansys workbench, Icepak, AEDT Knowledge in creating and modifying 3D CAD geometries for simulation.
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