Principal Electrical Engineer

Mercury Systems is seeking the best and brightest engineering talent to help us deliver cutting‑edge technology for mission‑critical aerospace and defense applications, advancing innovation where it matters most.

In this role, our team is looking for a Principal Electrical Engineer who will serve as a Hardware Design/Substrate Design technical leader, driving the development of rugged, high‑reliability microelectronics for defense, aerospace, and space systems. You will lead substrate and hardware design from concept through delivery, shaping engineering standards, guiding complex technical decisions, and ensuring extreme reliability in the harshest environments. Working within Mercury’s Integrator Mindset, you will collaborate across sites and disciplines to create breakthrough microelectronic solutions that directly strengthen national security and support onshore trusted manufacturing.

Job Responsibilities:

Lead cross‑functional teams to architect and develop complex System‑in‑Package (SiP) designs from concept through production

Manage the design of microelectronic digital and RF packaged circuits that meet system and customer requirements

Execute microelectronics hardware development involving FPGAs, DACs, ADCs, storage devices, and other advanced components

Design and analyze high‑speed digital interfaces including Ethernet, PCIe, DDR, SATA, USB, and other mission‑critical interfaces

Lead design quality activities through peer reviews, verification practices, and rigorous testing to minimize integration risk.

Coordinate with manufacturing and test teams to resolve build issues, support DFM/DFA/DFT efforts, and participate in detailed failure investigations

Develop schematics and layout for SiPs using Cadence toolsets and collaborate closely with layout and signal‑integrity teams

Provide hands‑on support during SiP layout and perform signal‑integrity analysis to ensure robust high‑speed performance

Support proposal development by contributing technical architectures, cost and schedule estimates, and Basis of Estimate (BOE) inputs

Required Qualifications:

Bachelor’s or higher-level degree in Electrical Engineering, Computer Engineering, or equivalent

Typically requires a minimum of 6 years of microelectronics packaging experience

Experience leading microelectronics packaging efforts across cross‑functional engineering teams

Strong expertise in electronic circuit design, schematic capture, and troubleshooting across digital, analog, and power circuits

Deep knowledge of high‑speed digital design, signal‑integrity fundamentals, IC package stack ups and advanced packaging techniques

Experience working directly with substrate and interposer fabricators

Experience mentoring junior engineers and leading engineering activities or small technical teams

“This position requires you to have or obtain a government security clearance. Security clearances may only be granted to U.S. citizens.”

Preferred Qualifications

• Experience with FPGA‑based designs using Intel (Altera) or AMD (Xilinx)

• Experience working with high‑frequency DACs and ADCs

• Development experience with embedded high‑speed interfaces (25G+)

• Proficiency with Cadence Allegro APD for layout analysis and design review

• Extensive understanding of signal‑integrity principles for high‑speed digital designs

• Understanding of RF design fundamentals for microelectronic applications

• Experience using requirements‑management or collaboration tools such as JAMA, JIRA, or Confluence

• Familiarity with DFM, DFT, DFR, and cost‑conscious design methodologies

• Experience supporting proposals, cost/schedule estimates, and Basis of Estimate (BOE) development

• Active DoD Secret Clearance or the ability to obtain one