Process Engineer (Etching & NaOH) (Kanchipuram)

Role & responsibilities - Expertise in developing, optimizing, and maintaining exact, high-yield etch processes for crystalline silicon and dielectric materials (e.g., SiO, AlO) used in microfabrication environments such as MEMS, sensors, or advanced packaging. - Expertise in develop, tune, and control anisotropic etching of monocrystalline silicon using NaOH-based aqueous solutions and develop etch processes for dielectric layers including SiO (thermal, PECVD, TEOS), AlO, TaO, HfO, TiO Experience in Wet Etching Equipment: Quartz or Teflon tanks, temperature-controlled baths, DI rinsing, IPA drying , Dry Etch Tools: RIE/ICP systems (Oxford, SPTS, Plasma-Therm, Samco, etc.) and Etch Chemistries like Wet: NaOH, KOH, TMAH, BOE, BHF, HF vapor, Dry: CF, CHF, SF, Ar/O, Materials: Monocrystalline silicon, SiO, SiN, AlO, Cr masks and Metrology: SEM, AFM, profilometer, ellipsometer, FTIR, XPS - Collaborate with Quality, Production, and other Cross functional teams to validate processes and implement engineering changes in terms of Kaizen, Cost Saving, Man power Optimization and Poka Yoke effectively. Initiate the Continuous Improvement and Lean Manufacturing Principles to Streamline Production Process, Optimize the Work Flow, Eliminate the Waste and to Improve the Operational Efficiency. Expertise in conducting and document Process Capability studies (Cp, Cpk) and improve Overall Equipment Effectiveness (OEE) to maximize machine productivity and minimize downtime. - Hands of Experience in conducting the experiment like DOE (Design of Experiments), SPC (Statistical Process Control) analysis, Waterfall Study and Data-driven yield improvements. - Define Process Parameters, DFM, SOP & Other Documents supported for the Process, Consumables, Secondary Operations, and Qualifications. - Expertise in preparing detailed Process Flow Diagrams (PFDs), Process Failure Mode and Effects Analysis (PFMEAs), and Control Plans (CPs) for effective process management and risk mitigation. - Support Internal and External audits (Includes Customer Audit) by ensuring document traceability, calibration records, and compliance to documentation protocols. - Continuously monitor and update key manufacturing performance metrics including OPP (Overall Process Performance), OEE (Overall Equipment Effectiveness), PPH (Parts Per Hour), FTQ (First Time Quality), tool and consumable usage, CPC (Cost Per Component), and scrap cost. Preferred candidate profile - Bachelor of Engineering degree in Chemical Engineering, Mechanical Engineering, Manufacturing Engineering, or related field. Others please don't apply. - 5 to 10 years of experience in a semiconductor, MEMS, photonics, or microfabrication environment with deep process ownership of: NaOH or KOH-based silicon etching, Dry and wet etching of inorganic oxides (SiO, AlO, etc.) - Expertise in anisotropic silicon etching profile simulation and Familiarity with 100 mm / 150 mm / 200 mm wafer processes - Familiarity with ISO 9001 / ISO 14001 / ISO 45001 (as applicable to industry). - Excellent interpersonal and communication skills must influence and collaborate globally .