Optoelectronic Integration Researcher

The candidate will work directly with other Nokia Bell Labs researchers and Nokia business units to help define integration architectures, advanced substrates, and assembly processes for optical subassemblies. As part of Nokia Bell Labs, you will contribute to forward-looking research while shaping practical integration approaches for next-generation optical systems. The candidate will have expertise in the design and optimization of high-speed (>100 GHz) electrical and optical I/O, including EIC-PIC (driver-modulator and detector-TIA), substrate and package transitions, and optical interconnects (waveguides, couplers and fiber interfaces). The candidate will define and evaluate integration architectures for co-packaged and heterogeneous subsystems, including substrate materials, assembly techniques, and high-density electrical and optical routing strategies. The candidate will conduct high-frequency test and measurement, including network analysis and time-domain characterization, and have familiarity with wireline modulation formats (PAM, QAM). The candidate will work well and efficiently within a larger team with strong interpersonal skills and collaborate with other research groups in Nokia Bell Labs.