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NXP Semiconductors

secure connectivity solutions · automotive semiconductors

Packaging Development Engineer

MalaysiaPosted 4 days ago
HardwareUnspecifiedFull Time
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Responsibilities

Lead, plan, and execute projects related to process assembly development and validation Design, execute, and analyze process related experiments Use software to analyze data including statistical analysis Solve process issues using creative problem solving techniques Create process recipe for packaging development, qualify and transfer for high volume production Set up new specifications and procedures for production Initiate sharing of lesson learnt and best practices among manufacturing sites Lead / participate in Task Force Teams Identify risks and actions for risk mitigation manufacturing operation Lead / support process qualification activities

Requirements

Minimum Bachelor’s degree in Engineering or Sciences (or related field). Master or PhD holder is preferred. Good aptitude in statistical data analysis and problem solving skills Must exhibit pro-activeness in leading process characterization work, ability to take on new challenges an embrace changes Basic knowledge of project planning and experience in driving small projects Excellent communication and presentation skills Must demonstrate good initiative, collaboration, and interpersonal skills working with cross functional teams Must be committed to meet process / project deadlines and commitments

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