Equipment Process Manager

Requirement

• Hands-on experience in equipment engineering or process engineering for semiconductor diffusion and/or ion implantation processes (approximately 10+ years)

• Management experience in a semiconductor wafer fabrication facility (e.g., Team Leader, Section Manager, Project Manager, or equivalent)

• Proven experience leading projects and coordinating with cross-functional teams, including Manufacturing, Engineering, and Quality organizations

• Experience managing business relationships, negotiations, and collaboration with industry partners and external companies

• Strong English communication and negotiation skills for working with global teams at the U.S. headquarters and with suppliers

• Business-level English proficiency (TOEIC score of 600 or above preferred)

• Japanese language proficiency (equivalent to JLPT N2 level or above)

• Valid work authorization that permits employment in Japan at the time of application

• No visa sponsorship available for this position

Preferred Qualifications

• Knowledge beyond diffusion/implantation processes

• Experience with fab ramp-up or next-generation processes

• Experience in multinational companies

• Experience in driving process optimization and business improvement using AI technologies

• Ideal Candidate Profile

• Logical problem-solving based on data

• Ability to balance site-level and overall optimization

• Leadership across functions

• Adaptability to fast-changing industry

• Strong focus on team development

• Location and Compensation

• Location: Aizuwakamatsu, Fukushima, Japan

Salary: Flexible based on experience and skills