Source description
About the role
Qualifications
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PhD, Master’s, or Bachelor's degree in Electrical Engineering, Materials Science, Electrical Engineering, Physics, or a related field.
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Proven experience in semiconductor device design and development , specifically with discrete power FETs (trench MOSFETs, superjunction, or related structures).
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Experience with post wafer fab operations such as Back-Grind/Back Metallization, Packaging, Dicing and Singulation, module construction.
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Experience with wafer level testing, ILT/WAT/PCM and Probe. Familiarity with package level Final Testing especially for discrete power devices
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Experience taking technologies from development stage, through optimization and qualification and into volume ramp.
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Strong understanding of semiconductor physics, device reliability, and fabrication processes , including experience in 300mm fabrication .
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Demonstrated ability to translate high‑level objectives into actionable engineering plans and drive projects independently.
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Strong data‑driven problem‑solving skills using DOE, statistical analysis, SPC, 6‑sigma, and FMEA methodologies.
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Proficiency with TCAD, SPICE , and relevant simulation tools; experience in electro‑thermal and parasitic modeling preferred.
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Track record of leading or significantly contributing to technology development projects with measurable impact on performance, reliability, yield, or cost .
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Excellent communication skills with the ability to present complex technical topics clearly to both engineering and executive audiences.
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Ability to manage multiple projects simultaneously in a fast‑paced development environment
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Preferred Skills
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Experience with high‑voltage and high‑current power device applications .
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Knowledge of automotive AEC‑Q101 reliability testing , including HTGB, HTRB, power cycling, UIS, SOA, and mission‑profile testing.
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Familiarity with wide‑bandgap (SiC/GaN) devices , electro‑thermal coupling, ruggedness physics, and advanced packaging (DFN, TO‑leadframe, copper clip, modules).
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Hands‑on experience with design rules, device layout, and design environments .
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Strong background in statistical analysis and data tools (JMP, Python, MATLAB).
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Understanding of industry standards, safety, and regulatory requirements for power electronics
Salary: onsemi is excited to share the base salary range for this position is $147,000 to $250,000 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
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