Source description
About the role
New package technology and platform module development (Si-gel filled module).
Technical leadership on new power module technology and enabling technology for automotive/industrial application.
Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing and application team.
Package/design review for new package development, on-tme release with the first pass success (qualification).
Present technical finding, design review and recommendation to stakeholders and management.
Lead package related failure analysis, reliability testing and debug package issues.
Participate in customer meeting, provide technical clarification and support failure investigation.
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