Analog & Mixed-Signal IC Design Lead Engineer

Role Overview

We are seeking an Analog & Mixed-Signal IC Design Lead to drive the definition, execution, and delivery of next-generation high-speed interconnect silicon. This is a technical leadership role for an accomplished designer who pairs deep, hands-on expertise in high-speed wireline and mixed-signal design—SerDes front-ends, serial links beyond 10 Gbps, and precision data converters—with a proven track record of leading teams through multiple successful tape-outs in advanced CMOS nodes, including managing external design contractors to scale execution.

Key Responsibilities

Technical Leadership & Execution

• Lead an analog/mixed-signal design team across the full cycle—architecture, design, verification, tape-out, and bring-up—owning delivery for multiple concurrent tape-outs.

• Plan execution across advanced CMOS nodes: block partitioning, schedules, resource allocation, and PPA targets.

• Engage and manage external design contractors and IP vendors—scoping, reviewing, and integrating outsourced blocks to spec and schedule.

• Enforce design-review discipline and shared methodologies, and mentor the team as its primary technical escalation point.

Hands-On Design

• Design and verify high-speed analog/mixed-signal circuits: SerDes front-ends, serial links (>10 Gbps), ADCs, DACs, clock distribution, laser/modulator drivers, and TIAs.

• Architect wireline SerDes front-ends, optical interconnect ICs, and multi-Gbps signal chains from concept through tape-out.

• Develop transistor-level schematics and guide layout in advanced FinFET (7–16 nm) or SOI to meet PPA targets.

• Drive pre-silicon simulation and post-silicon bring-up, closing specification gaps from measured silicon data.

Required Qualifications

Education & Experience

• Ph.D. in Electrical Engineering (or related) with 6+ years, OR M.S. with 8+ years of analog/mixed-signal IC design experience.

• Proven experience leading analog/mixed-signal teams to successful execution, with multiple tape-outs delivered in advanced CMOS nodes.

Core Technical Skills

• High-speed wireline link design: broadband front-ends, wideband amplifiers, equalization (CTLE), line drivers, and SerDes front-ends.

• Building serial links beyond 10 Gbps, with knowledge of protocols such as PCIe, UCIe, and Ethernet / SerDes (NRZ / PAM-4).

• Laser/modulator drivers and TIAs for optical interconnect; high-speed ADC/DAC (SAR, pipeline, flash, current-steering) for DSP-based links.

• Hands-on design and multiple tape-outs in advanced CMOS / FinFET (5–16 nm) and/or SOI.

Leadership & Program Skills

• Proven ability to lead a multi-engineer team from architecture to silicon sign-off, and to manage external contractors and IP vendors.

• Strong project-planning, schedule-management, and cross-functional communication skills.

Preferred Qualifications

• • Familiarity with wireline PHY architectures (56G / 112G PAM-4 SerDes, NRZ) and die-to-die interconnect (UCIe).

• • Optical module ICs (TOSA/ROSA driver ASICs, coherent DSP interfaces); full-duplex, echo-cancellation, or DSP-based link architectures.

• • Cadence Virtuoso, Spectre / APS / Ultrasim, and lab characterization (oscilloscopes, VNAs, BERT setups).