Source description
About the role
Designs, develops and validates new electronics packaging solutions Possesses and applies a working knowledge of compliance requirements to designs including MIL-STD, UL, EN, CSA , CE and EV (AIS-138) charging standards Perform detailed component-level analysis to identify locations and operating conditions of high electromagnetic / thermal / mechanical stresses Survey and investigate advanced circuit topologies component/ board / packaging / manufacturing technologies to further improve circuit performance, fault-tolerance, and to reduce overall cost, weight, sizes Develop mixed-mode circuits for power electronics applications, to achieve high accuracy, robustness, and low power consumption Consolidate the discrete components to hybrid ICs to improve robustness and collaboration with manufacturing engineers and suppliers to transition concepts to production functionality, to reduce cost, size, and weight Integrate the power modules, cooling, gate drives, discrete component, and sensors in one package for better overall layout, robustness, easier manufacturing, and at a lower overall cost Generate BOM from conceptual design Plan, direct and completes product/part testing and validation Benchmark competitive solutions Understand customer technical needs. Resolves customer complaints Solve manufacturing issues (assembly, machining, etc.), quality issues (dimensional, material, and design discrepancies, etc.), and purchasing issues (vendor qualification, engineering support, etc). Manages product line cost reduction initiatives and reliability improvement initiatives.
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