Chip Top lead

Job Requirements Role Overview We are looking for an experienced Physical Design Chip Lead to lead the end-to-end implementation of complex SoCs/ASICs. The candidate will be responsible for driving physical design activities, coordinating cross-functional teams, ensuring design closure, and meeting PPA (Power, Performance, Area) goals. Key Responsibilities Lead and own the full-chip physical design flow from RTL to GDSII. Drive floor planning, power planning, clock tree synthesis (CTS), placement, routing, and signoff (timing, IR-drop, EM, DRC/LVS). Coordinate with block-level PD owners and ensure seamless integration at the chip level. Analyse and optimize PPA to meet design targets. Collaborate with RTL, STA, power, DFT, verification, and package teams for design convergence. Lead ECO cycles for timing, congestion, and physical sign-off closure. Review and debug physical verification and timing issues. Manage schedules, resources, and risk tracking for PD deliverables. Prepare and present project status, risks, and mitigation plans to management and customers. Mentor and guide junior engineers in the team. Work Experience Required Skills & Experience 10+ years of experience in ASIC/SoC physical design with at least 3+ years in a lead role. Strong expertise in industry-standard PD tools (Cadence Innovus, Synopsys ICC2, etc.). Proven experience in full-chip integration and signoff flows. Good understanding of STA (PrimeTime), physical verification (Calibre), and low-power design methodologies (UPF/CPF). Hands-on experience with process nodes (22nm / 28nm preferred). Strong debugging and problem-solving skills in timing, congestion, and physical verification. Familiarity with package/chip co-design and IO planning. Hands on experience in handling Analog custom routes, understanding the spec to meet R and C Good hands on experience in Full chip CTS implementation Good hands on experience in IO Ring creation, Partitioning, Timing budgeting, VA creation ( Design Planing activities ) Experience in multi-voltage, multi-frequency design Knowledge of EM/IR-drop analysis and mitigation techniques. Excellent communication and leadership skills.