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About the role
Senior Principal Engineer / Senior Manager – SoC / Chip Lead Memory Interface Division (MID) Experience 20+ Years Location US / Bangalore About the Role We are seeking a highly accomplished Senior Principal Engineer / Senior Manager – Chip Lead to drive the development and execution of next-generation high-performance SoC products. This role will provide end-to-end technical leadership spanning architecture definition, SoC integration, execution planning, silicon realization, and product bring-up. The ideal candidate will have a strong track record of leading complex, advanced-node SoCs from concept through production, with deep expertise in large-scale digital integration, high-speed interfaces, and cross-functional execution. The role requires close collaboration with architecture, design, verification, physical design, DFT, firmware, package, analog, and product engineering teams to ensure successful delivery of world-class silicon products. Key Responsibilities Own end-to-end technical leadership and execution of complex SoC programs from architecture through silicon production. Drive l, integration strategy, execution schedules, risk management, and tape-out readiness. Lead cross-functional teams across digital design, verification, physical design, DFT, firmware, validation, packaging, and product engineering. Define chip-level architecture, integration requirements, performance targets, and power/area objectives. Drive technical decision-making and trade-off analysis across architecture, implementation, and product requirements. Oversee subsystem and IP integration, ensuring successful deployment of complex multi-domain SoCs. Partner with analog and SerDes teams to integrate high-speed interfaces and mixed-signal subsystems into the overall chip architecture. Lead design reviews, execution reviews, silicon readiness assessments, and post-silicon debug activities. Drive issue resolution across the development lifecycle and ensure successful first-pass silicon execution. Mentor senior engineers and provide technical leadership across multiple engineering organizations. Required Qualifications Bachelor's, Master's, or Ph.D. in Electrical Engineering, Computer Engineering, or related discipline. 20+ years of semiconductor industry experience with substantial leadership responsibility. Proven experience as a Chip Lead, SoC Lead, Technical Program Lead, or equivalent role for large-scale ASIC/SoC products. Demonstrated success leading advanced-node SoCs, preferably at 3nm and/or 5nm technology nodes . Deep understanding of SoC architecture, integration methodologies, and full-chip development flows. Strong experience working across: RTL Design Design Verification Physical Design DFT Static Timing Analysis Low-Power Design Methodologies Silicon Bring-up and Productization Experience managing complex schedules, technical dependencies, and cross-functional execution across global teams. Strong communication, stakeholder management, and engineering leadership skills. Preferred Qualifications Prior experience with: High-performance switching silicon Network-on-Chip (NoC) architectures Data movement and interconnect fabrics High-bandwidth memory-centric systems Complex multi-die or chiplet-based architectures Hands-on experience integrating: High-speed SerDes interfaces Analog front-end (AFE) subsystems Mixed-signal IPs Advanced PHY technologies Experience with high-bandwidth and low-latency interconnect technologies. Knowledge of packaging technologies and signal integrity considerations for high-speed systems. Experience in AI, HPC, networking, connectivity, data-center, or memory infrastructure products. Prior exposure to UALink, Ethernet switching, switch fabrics, or similar high-performance interconnect technologies is highly desirable. Leadership Expectations Establish technical vision and execution strategy for complex SoC products. Drive alignment across architecture, engineering, and product stakeholders. Build and mentor high-performing engineering teams. Ensure engineering excellence, predictable execution, and first-silicon success. Champion best practices in SoC development, integration, and system-level design.
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