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About the role
We are looking for an experienced leader for high performance SOCs/MCUs, for board and packaging group. Essential Functions: Highly experienced in board and package design from block level to final board and package delivery. Should have the ability to work independently with little supervision and drive the team to define, develop and execute the product plan from specification to release. Must be a natural team player and strive towards fostering a highly creative and productive working environment Qualifications Minimum Requirements: MTech/BTech in EC/ EE/CS with hardware engineering experience of 7 to 15 years. Experience in Microcontroller and Microprocessor based complex design Experience in latest packaging Technologies and Manufacturing process Strong domain knowledge of system clocking, system modes, power management, debug Additional Preferred Qualifications: Board level System architecture and design includes memory or communication interfaces. SOC specifications and board level system specifications. Development and design of SOC power supply, system power supply specifications, and PMIC specifications. Interface specifications incorporating SOC-peripheral devices Experience with high-speed interface i. e. PCIe Gen3/4/5/, LPDDR 4/4x/5/5x, UFS, Ethernet, Flash memory Board level DC/AC simulations. Schematic, Layout and BOM generation using modern CAD tools Experience with SoC Bring-up activities Familiarity with PCB technologies, DFM, DFA, materials, stackup design, assembly rules and manufacturing process Experience with tools: Ansys HFSS or Cadence SI/PI, or other SI/PI, Cadence APD (Allegro Package Designer) for IC package layout design, SIwave, HSPICE, ADS, Q3D Experience in IC packaging layout design, emphasizing advanced technologies like SiP (System-in-Package), flip-chip, and 3D packaging. Comprehensive knowledge of packaging design aspects, encompassing power distribution, thermal control, and signal fidelity. Thermal simulation experience is added advantage. Profound understanding of semiconductor manufacturing methodologies and packaging assembly processes Ability to automate the SI, PI and Packaging activities using scripting tools like Python, TCL Disclaimer : This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.
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