Staff Engineer, Packaging Engineering

Our Package Design Engineering team is seeking a talented Staff Engineer with expertise in thermal management, based at our Bangalore site. In this role, you will be pivotal in driving innovation in thermal design for our high-performance flash products, as well as developing and maintaining advanced simulation tools. ESSENTIAL DUTIES AND RESPONSIBILITIES: Work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level. Innovate thermal management solutions for high-performance flash products Enhance and maintain our modeling and simulation infrastructure to improve efficiency and accuracy across the design and manufacturing processes. This position may interface with package & product design, electrical, thermal and physical characterization, reliability testing, failure analysis, assembly R&D and other process teams.Qualifications REQUIRED: Ph.D. in Mechanical Engineering, or M.S. in Mechanical Engineering plus >2 years of relevant industrial experience. Solid knowledge through academic coursework or research experience required in thermal engineering. Working knowledge in designing and conducting thermal testing and/or using a commercial CFD/FEA package. SKILLS: Strong analytical and quantitative problem-solving ability Good communication, relationship skills and a team player PREFERRED: Knowledge in thermal, structural or mechanical in package engineering Interested in semiconductor industry. Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.