Staff Package Design Engineer

Collaborate with cross-functional teams to drive package designs that meets Cirrus performance, reliability, and manufacturability requirements

Define package requirements from electrical, thermal, and mechanical point of view in close cooperation with Design and layout teams

Utilize AutoCAD, GDS tools, Siemen Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information

Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB

Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages

Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues

Grow and promote automation processes throughout the package design flow

Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance

Close collaboration with customers to resolve various design issues between the piece part and PCB