Source description
About the role
Required Qualifications:
Demonstrated understanding of Semiconductor technology, manufacturing, new product development, device, and yield improvement.
Education: BS in Engineering or Material Science, MS or PhD preferred
Experience: 6-10 years or more relevant experience in semiconductor manufacturing integration and technology development.
Proven experience and a deep knowledge and understanding of wafer thinning and back-metal processes, including bond/debond, grind, silicon wet etch, PVD, plating, TSV, RDL, etc.
Proven experience and a deep knowledge and understanding of power semiconductors, CMOS, and BCD integration is preferred.
Assembly processing and advanced module construction are positive.
Proficiency in SW tools such as MS Excel, PowerPoint, Word, MS Project, and Yield analysis tools such as Excensio, Spotfire, JMP, Minitab, etc.
Knowledge and proven experience with DOE, 6-sigma, Lean, models-based problem solving, 5S, 8D, SPC, DOE, FMEA
Ability to influence and lead decisions on capital equipment to enhance new technology capabilities and execution.
Knowledge of assembly and package interconnect processes preferred.
Experience using predictive thermo-mechanical simulations is preferred.
Language Fluency – Fluent in English Language, written & verbal
Salary: onsemi is excited to share the base salary range for this position is $114.000 to $193,700 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
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