Entry Level for ONSC Process Engineering (Master)

Bachelor’s degree or above in Electrical/Electronic Engineering, Mechanical Engineering, Materials Science, Semiconductor Engineering, Physics, or a related technical discipline.

Familiarity with semiconductor assembly, packaging, process flow, equipment capability, product qualification, engineering build control, and manufacturing documentation.

Experience with power module, discrete, IC package, advanced packaging, automotive qualification, or high-reliability manufacturing environment is preferred.

For senior level, demonstrated ability to independently lead complex NPI projects, manage cross-functional risks, influence stakeholders, and drive qualification or production release decisions.

Solid knowledge of DOE, SPC, FMEA, control plan, OCAP, 8D problem solving, failure analysis, process capability, yield analysis, and engineering report writing.

Good understanding of product characteristics, process interactions, material behavior, equipment capability, CTQ parameters, and qualification requirements.

Able to gather, organize, analyze, visualize, and interpret engineering data using tools such as Excel, JMP, Minitab, Power BI, or equivalent statistical/data analysis software.

Strong project management discipline, including milestone planning, action tracking, risk escalation, stakeholder alignment, and timely closure of technical deliverables.

Able to work independently, manage multiple priorities, and communicate clearly with engineering, manufacturing, quality, management, customer-facing teams, and external partners.

Good written and verbal communication skills in English; Chinese communication capability is preferred when supporting China-based customers, suppliers, or manufacturing partners.