Source description
About the role
Essential Responsibilities
New Product Development: Support product development from initial design through full-scale manufacturing, ensuring complete documentation for ONSEMI’s process change review process.
Process Optimization: Collaborate with Manufacturing Engineering to recommend and implement manufacturable process recipes that meet yield and reliability targets.
Technical Expertise:
Demonstrate understanding of semiconductor technology, device physics, yield improvement, and manufacturing processes.
Novel Insulator integration into wafer packaging.
Chip Package Interaction (CPI) experience is a plus.
Chip-scale module construction.
Power FET experience, Power Module experience.
Experience with copper plating and wafer thinning is a plus.
Key skills/experience for this position are Pick-and-place, sintering, CSP, and advanced packaging.
Additional skills/experience for this position are RDL, advanced packaging integration, polyimide, dicing, and module assembly.
Data Analysis & Tools:
Proficiency in MS Excel, PowerPoint, Word, and MS Project.
Skilled in yield analysis tools such as Shiny, Excensio, JMP, Minitab, etc.
Automation processing software such as SiView.
Cross-Functional Collaboration:
Work effectively within a global matrixed team and independently drive projects to completion.
Communicate clearly with all levels of the organization, including executive leadership.
Execution & Leadership:
Operate independently, translating high-level objectives into detailed execution plans.
Act as a team player with strong listening skills, able to incorporate input and make informed decisions.
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