Manufacturing Integration Engineer

Qualifications

Master’s or Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field. 2+ years of experience in semiconductor manufacturing, specifically with discrete power FETs (trench MOSFETs, superjunctions, or related structures). Understanding of semiconductor physics, device reliability, and fabrication processes, including experience in 300mm fabrication. Experience taking technologies from early manufacturing to high volume ramp. Demonstrated ability to translate high‑level objectives into actionable engineering plans and to drive projects independently. Strong data‑driven problem‑solving skills using DOE, statistical analysis, SPC, 6‑sigma, and FMEA methodologies. Excellent communication skills with the ability to present complex technical topics clearly to both engineering and executive audiences. Ability to manage multiple projects simultaneously in a fast‑paced development environment Prefer experience with post-wafer fab operations, including Back-Grind/Back Metallization, Packaging, Dicing and Singulation, and module construction. Prefer experience with wafer level testing, ILT/WAT/PCM and Probe.  Familiarity with package-level final testing, especially for discrete power devices Salary: onsemi is excited to share the base salary range for this position is $75,300 to $120,400 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf