Source description
About the role
Key Responsibilities:
Serve as the principal technical expert for wafer backgrind, thinning, and metallization processes in preparation for die assembly and final test.
Provide deep technical guidance across wafer fabrication, back‑end assembly and packaging, final electrical testing, and reliability qualification.
Support yield learning, defect reduction, and root cause investigations using semiconductor failure analysis techniques, advanced data analytics, and pattern recognition approaches.
Lead post‑Fab process development, optimization, and sustainment to ensure manufacturability, robustness, yield, and cost competitiveness.
Apply AI‑assisted data analysis, statistical learning, and automation tools to identify process trends, anomalies, and improvement opportunities in high‑volume manufacturing environments.
Partner with Fab, Assembly, Test, Quality, Equipment, IT, and external suppliers to deploy data‑driven and AI‑enabled solutions that enhance process capability, cycle time, and operational efficiency.
Own and execute high‑impact, self‑directed technical and manufacturing projects, ensuring alignment with business objectives, timelines, and quality standards.
Anticipate technical risks, define mitigation strategies, and leverage predictive insights where applicable to proactively address manufacturing challenges.
Communicate complex technical and data‑driven insights effectively to senior management and executive stakeholders, supporting informed strategic and operational decisions.
Prepare and deliver high‑quality technical presentations and analytics‑based reports, translating advanced process and AI insights into clear business impact.
Act as a trusted technical advisor and collaborative leader within a highly matrixed, global organization.
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