Source description
About the role
• Education
•Bachelor’s degree in Engineering (Mechanical, Electronics, Chemical, or related field).
• Experience
•8+ years in semiconductor assembly (Die Attach / Wire Bond), with proven leadership in high‑mix, high‑complexity FOL operations.
•Demonstrated capability in yield improvement, DOE, SPC, PFMEA/Control Plan, and equipment/materials qualification.
• Skills & Knowledge Requirements
•Strong technical mastery in FOL processes (DA, WB, Clip Attach, Plasma) and failure mechanisms.
•Excellent analytical skills (Minitab/Exensio/SPC), problem‑solving (8D, DMAIC), and audit/customer‑facing communication.
•Ability to lead teams, manage cross‑functional escalations, and sustain process governance under high‑volume/high‑complexity environments
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