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Silicon Carbide (SiC) · Power semiconductors

Staff Process Engineer - Die Attach / Clip Attach

PhilippinesPosted 3 months ago
Industrial And Manufacturing EngineeringUnspecified
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Opens the source posting on hctz.fa.us2.oraclecloud.com

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ØProcess Ownership & Control

•Define, sustain and optimize key die attach parameters and tooling effectiveness.

•Establish and maintain the recipe management system, process/set-up controls, process capability, process performance (Ppk).

•Generates and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), reaction plans (OCAP)

ØYield & Quality Improvement

•Lead problem solving using 8 Discipline for internal and external issues such as customer complaints (EFAR).

•Knowledgeable in DMAIC approach for continuous improvement projects.

•Well verse in using the root cause analysis tools such as 5‑Whys/Ishikawa for issues induced by the die attach process especially for GMRB documentation

•Reduce ppm loss and scrap disposition through targeted DOEs, parameter windows process validation, and direct material/tooling improvements.

ØEquipment & Materials Engineering

•Own the effectiveness of the recipe management system, drives tooling design and qualification.

•Qualify materials (solder paste/DAF, flux, substrates/leadframes, plating finishes) and define incoming/line qualification criteria.

ØCompliance & Audits

•Prepare evidence for customer audits, IATF/ISO, and internal audits

•Ensures compliance to change control management.

ØCross‑Functional Leadership

•Partner with Production, Equipment, Quality, PE, NPI, Planning, SQE to ensure output, OEE, quality and delivery goals.

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