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About the role
Must be either graduate in the field of BS in Mechanical or Electronics & Communications or Chemical Engineering, or equivalent.
More than 10 years of experience in molding process.
Proven hands-on experience with transfer molding equipment (e.g., TOWA, FUSEI)
Strong knowledge of Epoxy Molding Compound (EMC), including material properties and processing behavior
Extensive familiarity with semiconductor package molding processes, including transfer molding, IC encapsulation, and discrete/power device packaging
Demonstrated expertise in troubleshooting complex molding issues and driving process optimization to improve yield, quality, and cycle time
Strong analytical and problem-solving capabilities with a data-driven approach
Effective communication and collaboration skills, with the ability to work across cross-functional teams
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