Source description
About the role
Bachelor’s Degree in Engineering (ME, EE, IE or equivalent)
Minimum of 3 years Process Engineering experience in semiconductor manufacturing with hands-on experience in Wafer Saw / Die Preparation
Strong knowledge of Wafer Saw processes, materials, and defect mechanisms
Understands DFD6240, DFD6340/1, DFD6361/2, ADT2000, Laser Groove and other die preparation equipment.
Proficiency in SPC, DOE, Data Analysis, FMEA, Control Plan and Change Management
Solid problem-solving and root cause analysis (RCA) skills
Ability to manage multiple priorities in a high-volume environment
Strong technical ownership and decision-making capability
Effective cross-functional communication and collaboration
Experience in different FOL processes is an advantage
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