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About the role
III. Major Duties and Responsibilities
ØOwn and optimize ultrasonic wire bonding processes, including parameter definition, recipe control, SPC monitoring, and process capability.
ØDrive yield and quality improvements by troubleshooting wire bond defects (NSOP, broken/lifted wires, cratering, heel cracks, pad damage) using 8D, DMAIC, and root cause analysis tools.
ØDevelop and maintain PFMEA, Control Plans, Work Instructions, OCAPs, and support GMRB documentation.
ØLead process characterization through DOE, window validation, and material/tooling optimizations.
ØManage bonding tools and consumables, including wedge selection, tooling life definition, and equipment capability for Orthodyne, K&S Power Fusion, and Shinkawa platforms.
ØSupport customer audits, IATF/ISO compliance, and change control activities.
ØCollaborate with Production, Quality, Equipment, and NPI teams to support volume manufacturing, line transfers, and new product ramps.
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