TD EOL Process engineer

As a Semiconductor Packaging Solutions Development Lead at Tata Electronics Private Limited, your primary role will be to develop cutting-edge, cost-effective packaging solutions for integrated circuits. You will be responsible for ensuring optimal performance, reliability, and manufacturability of the products. Your key responsibilities will include: - Being hands-on in designing DOE, Process characterization & optimization, and developing manufacturable recipes meeting all the CTQ matrices & yield. - Demonstrating a strong understanding of semiconductor packaging materials, processes, and failure mechanisms. - Providing direction, technical leadership, and hands-on experience to ensure all different functional departments work in sync to achieve common departmental/organizational goals. - Leading, understanding, integrating, and innovating to meet customers packaging requirements into a cost-competitive DFM solution. - Creating a characterization plan and risk assessment for new and existing devices requiring engineering support. - Driving yield and quality improvement initiatives. - Guiding NPI & Process SMEs in resolving yield and quality issues. - Defining process flows and material sets, sourcing, characterizing material, developing and executing standard operating procedures (SOPs), and ensuring all designs meet quality and industry standards. - Interfacing with customers for TD/engineer activities, quality performance meetings, managing issues, and working with TPM/Customer for new NPI design win opportunities & technical issues. - Driving material cost reduction programs through value engineering programs. - Co-working cohesively with all supporting groups & operations team. Your work will involve in-depth knowledge of DOE/SPC/FMEA/MSA/JMP and other problem-solving methodology tools, along with a proven record in process stabilization, yield improvement, and high-volume manufacturing support. The qualifications required for this role include a degree in Engineering or its equivalent. Ideally, you should have a minimum of 15 years of experience in TD Development, Assembly Process Engineering in a multinational OSAT industry, knowledgeable in package assembly process equipment & manufacturing, familiar with APQP and Automotive standards, and experienced in leading a group or team of employees in achieving organizational goals. Previous experience in both start-up and high-volume manufacturing environments would be an added advantage. Join Tata Electronics to be part of a pioneering venture in India's semiconductor industry, contributing to cutting-edge technological advancements. As a Semiconductor Packaging Solutions Development Lead at Tata Electronics Private Limited, your primary role will be to develop cutting-edge, cost-effective packaging solutions for integrated circuits. You will be responsible for ensuring optimal performance, reliability, and manufacturability of the products. Your key responsibilities will include: - Being hands-on in designing DOE, Process characterization & optimization, and developing manufacturable recipes meeting all the CTQ matrices & yield. - Demonstrating a strong understanding of semiconductor packaging materials, processes, and failure mechanisms. - Providing direction, technical leadership, and hands-on experience to ensure all different functional departments work in sync to achieve common departmental/organizational goals. - Leading, understanding, integrating, and innovating to meet customers packaging requirements into a cost-competitive DFM solution. - Creating a characterization plan and risk assessment for new and existing devices requiring engineering support. - Driving yield and quality improvement initiatives. - Guiding NPI & Process SMEs in resolving yield and quality issues. - Defining process flows and material sets, sourcing, characterizing material, developing and executing standard operating procedures (SOPs), and ensuring all designs meet quality and industry standards. - Interfacing with customers for TD/engineer activities, quality performance meetings, managing issues, and working with TPM/Customer for new NPI design win opportunities & technical issues. - Driving material cost reduction programs through value engineering programs. - Co-working cohesively with all supporting groups & operations team. Your work will involve in-depth knowledge of DOE/SPC/FMEA/MSA/JMP and other problem-solving methodology tools, along with a proven record in process stabilization, yield improvement, and high-volume manufacturing support. The qualifications required for this role include a degree in Engineering or its equivalent. Ideally, you should have a minimum of 15 years of experience in TD Development, Assembly Process Engineering in a multinational OSAT industry, knowledgeable in package assembly process equipment & manufacturing, familiar with APQP and Automotive standards, and experienced in leading a group or team of employees in achievin