Source description
About the role
Job Summary: This position is responsible for scribe&break processing of semiconductor laser wafer fab within the factory. The Engineer will maintain process control and yield objectives and contribute to process development initiatives in collaboration with other groups. The engineer has deep understanding of scribe&break processing and provides input to device design and integration. This person will may work on tasks that spans multiple process areas.
More at Coherent
Related open roles
Dicing Technician II
United States
Staff Engineer, Quality
United States · Onsite
Distinguished MTS
San Francisco Bay Area · Onsite
Principal Volume Production Engineer
United States · Onsite
Process Engineering Technician Die Sort
United States · Onsite
Process Engineering Technician Facet Coat/Sribe&Break
United States
